US Patent 10937736 Hybrid integrated circuit package and method

In an embodiment, a device includes: a first and second integrated circuit die; and a hybrid redistribution structure including: a first photonic die; a second photonic die; a first dielectric layer laterally surrounding the first photonic die and the second photonic die, the first integrated circuit die and the second integrated circuit die being disposed adjacent a first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a major surface of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; a second dielectric layer disposed adjacent a second side of the first dielectric layer; and a waveguide disposed between the first dielectric layer and the second dielectric layer, the waveguide optically coupling the first and second photonic dies.