Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yang-Che Chen0
Chwen-Ming Liu0
Huang-Wen Tseng0
Victor Chiang Liang0
Chen-Hua Lin0
Date of Patent
March 2, 2021
0Patent Application Number
164253540
Date Filed
May 29, 2019
0Patent Primary Examiner
Patent abstract
A semiconductor package structure includes an interconnection structure having a first surface and a second surface opposite to the first surface, a die surrounded by a molding compound over the first surface of the interconnection structure, and a passive device surrounded by a dielectric structure over the second surface of the interconnection structure. The passive device is electrically coupled to the die by the interconnection structure.
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