Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 16, 2021
Patent Application Number
16118231
Date Filed
August 30, 2018
Patent Primary Examiner
Patent abstract
A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
