Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yu-Ju Liao0
Chien-Fan Chen0
Chien-Hao Wang0
Date of Patent
March 16, 2021
0Patent Application Number
163975390
Date Filed
April 29, 2019
0Patent Primary Examiner
Patent abstract
An embedded component package structure including a dielectric structure and a component is provided. The component is embedded in the dielectric structure and is provided with a plurality of conductive pillars. The conductive pillars are exposed from an upper surface of the dielectric structure and have a first thickness and a second thickness, respectively, and the first thickness is not equal to the second thickness.
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