US Patent 10950562 Impedance-matched through-wafer transition using integrated heat-spreader technology
Patent 10950562 was granted and assigned to Hrl Laboratories, Llc on March, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 3, 2019
Date of Patent
March 16, 2021
Patent Applicant
Patent Application Number
16559486
Patent Inventor Names
Florian G. Herrault
0
Eric M. Prophet
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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