US Patent 10957621 Heat sink for a power semiconductor module

A power semiconductor module has a base plate with a heat sink affixed thereto, a housing affixed to the base plate, a DC busbar affixed to the base plate and to the housing, an AC busbar affixed to the base plate and to the housing on a side of the housing opposite the DC busbar, and control electronics positioned in an interior of the housing and connected to the DC busbar and to the AC busbar. The heat sink has a plurality of pins affixed to one side of the base plate and extending outwardly therefrom. Each of the plurality of pins is of a forged or impact extruded pure aluminum material.