Patent attributes
A light emitting device (LED) package includes: a substrate having a loading surface, a mounting surface and a pair of concave portions formed at both ends of the substrate, wherein each of the concave portions has an inner surface intersecting both of the loading surface and the mounting surface; metal wirings including a pair of electrodes, which covers a portion of the loading surface and the mounting surface and the inner surface, and a conductive part disposed on the loading surface; an LED chip loaded on the conductive part; a housing having a side wall surrounding the LED chip and a supporting surface facing the loading surface; and a covering member which is disposed on the loading surface and has a closing portion overlapping at least a portion of the concave portions when viewed from above, wherein at least a portion of the supporting surface is fixed to the closing portion.