US Patent 10957747 Electronic panel and method for manufacturing the same

An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.