US Patent 10957997 High density connector assembly
Patent 10957997 was granted and assigned to 3M on March, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
0
Date Filed
October 29, 2019
0
Date of Patent
March 23, 2021
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Patent Applicant
0
Patent Application Number
16666497
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Patent Citations Received
Patent Inventor Names
Saujit Bandhu
0
Kok Hoe Lee
0
Vincent Tan
0
YunLong Qiao
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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