Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takeaki Tamayama0
Akihiro Motoki0
Date of Patent
March 23, 2021
Patent Application Number
16668451
Date Filed
October 30, 2019
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A circuit block assembly is provided that includes circuit blocks that each include a circuit board and a semiconductor element that is disposed on a first main surface of the circuit board. Moreover, each of the circuit blocks includes a metal heat spreader that is connected to the semiconductor element directly or by a thermally conductive member interposed therebetween. A thermally conductive sheet is provided that is thermally connected to the heat spreader. The thermally conductive sheet has a specific electrical resistance higher than a specific electrical resistance of the heat spreader.
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