Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seokhyun Lee0
Kyoung Lim Suk0
Date of Patent
March 30, 2021
0Patent Application Number
166967590
Date Filed
November 26, 2019
0Patent Primary Examiner
Patent abstract
Insulating layers of a redistribution layer of a semiconductor package may be formed as a polymer film having inorganic fillers formed therein. The inorganic fillers may trap reactive materials to inhibit and/or substantially prevent the metal conductors, such as chip pads of the semiconductor chip being packaged, from being damaged by the reactive material. As a result, the reliability and the durability of the semiconductor package may be improved.
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