Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Date of Patent
April 6, 2021
Patent Application Number
16881898
Date Filed
May 22, 2020
Patent Citations
Patent Primary Examiner
Patent abstract
A device includes a first chip is embedded in a molding compound layer, wherein the first chip is shifted toward a first direction, a second chip over the first chip and embedded in the molding compound layer, wherein the second chip is shifted toward a second direction opposite to the first direction and a plurality of bumps between the first chip and the second chip.
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