Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 6, 2021
Patent Application Number
16411191
Date Filed
May 14, 2019
Patent Primary Examiner
Patent abstract
A semiconductor package is provided. The semiconductor package includes a first package comprising a first substrate and a first semiconductor chip, a second package arranged on the first package, and the second package comprising a second substrate and a second semiconductor chip, a first solder ball and a supporter layer arranged between the first package and the second package, and a dam arranged between the first package and the second package, the dam being in contact with a sidewall of the supporter layer, and the dam completely surrounding the sidewall of the supporter layer.
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