Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 10971469 Semiconductor device including various peripheral areas having different thicknesses

Patent 10971469 was granted and assigned to LAPIS Semiconductor Co.,Ltd. on April, 2021 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Patent abstract

Reliability of joining between semiconductor chips is improved by promoting filling of a sealing resin into a gap formed between the semiconductor chips.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 10971469 Semiconductor device including various peripheral areas having different thicknesses

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo