US Patent 10971929 Chip ESD protection circuit

The present invention provides a chip ESD protection circuit, includes an integrated circuit layer and a conductive layer. A first ground bonding pad that is connected to a first ground wire of a first power domain is disposed on each of the first power domain and a second power domain in the integrated circuit layer. The first ground bonding pads are bonded to the conductive layer. A second power clamping unit is disposed on the second power domain. A first end of the second power clamping unit is connected to a second power wire of the second power domain, and a second end thereof is connected to the first ground wire or a second ground wire of the second power domain. According to the chip ESD protection circuit, the ESD protection capability of a chip can be improved. The occupied area of the chip is reduced.