Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jhih-Yu Wang0
Hung-Jui Kuo0
Sih-Hao Liao0
Yu-Hsiang Hu0
Date of Patent
April 13, 2021
0Patent Application Number
166678380
Date Filed
October 29, 2019
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated fan-out (InFO) package includes an encapsulant, a die, a plurality of conductive structures, and a redistribution structure. The die and the conductive structures are encapsulated by the encapsulant. The conductive structures surround the die. The redistribution structure is disposed on the encapsulant. The redistribution structure includes a plurality of routing patterns, a plurality of conductive vias, and a plurality of alignment marks. The conductive vias interconnects the routing patterns. At least one of the alignment mark is in physical contact with the encapsulant.
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