US Patent 10978475 Three-dimensional semiconductor memory device

A three-dimensional semiconductor memory device may include a substrate including a cell array region and a pad region, a first conductive line on the cell array region and the pad region of the substrate, a second conductive line between the first conductive line and the substrate, the second conductive line including a first portion on the cell array region and a second portion on the pad region and exposed by the first conductive line in a plan view, a first edge pattern between the substrate and the first conductive line and between the first and second portions of the second conductive line, and a first cell contact plug on the pad region of the substrate that penetrates the first conductive line and the first edge pattern.