Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 13, 2021
Patent Application Number
16317580
Date Filed
September 6, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure provides an array substrate, including: a base substrate, a first metal, a buffer layer, a second metal, a second buffer layer, a third metal. A via is defined in the first buffer layer and the second buffer layer to electrically interconnect the first metal and the third metal, so that the first metal, the second metal and the third metal constitute parallel capacitors.
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