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US Patent 10978611 Semiconductor structure with chirp layer

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Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10978611
Patent Inventor Names
Guilherme Tosi0
Norbert Krause0
Date of Patent
April 13, 2021
Patent Application Number
17062369
Date Filed
October 2, 2020
Patent Citations Received
‌
US Patent 11978824 Buried contact layer for UV emitting device
0
‌
US Patent 11626535 Buried contact layer for UV emitting device
0
Patent Primary Examiner
‌
Matthew L Reames
Patent abstract

A semiconductor structure can comprise a plurality of first semiconductor layers comprising wide bandgap semiconductor layers, a narrow bandgap semiconductor layer, and a chirp layer between the plurality of first semiconductor layers and the narrow bandgap semiconductor layer. The values of overlap integrals between different electron wavefunctions in a conduction band of the chirp layer can be less than 0.05 for intersubband transition energies greater than 1.0 eV, and/or the values of overlaps between electron wavefunctions and barrier centers in a conduction band of the chirp layer can be less than 0.3 nm−1, when the structure is biased at an operating potential. The chirp layer can comprise a short-period superlattice with alternating wide bandgap barrier layers and narrow bandgap well layers, wherein the thickness of the barrier layers, or the well layers, or the thickness of both the barrier and well layers changes throughout the chirp layer.

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