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US Patent 10979062 Data acquisition system-in-package
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Date Filed
April 24, 2020
Date of Patent
April 13, 2021
Patent Application Number
16858099
Patent Citations
US Patent 10680633 Data acquisition system-in-package
US Patent 10756056 Methods and structures for wafer-level system in package
US Patent 10665534 Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package
US Patent 10700011 Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10979062
Patent Primary Examiner
Brian K Young
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