US Patent 10980154 Cooling design for PCIE mounted server peripheral electronics

A fluid cooling module (or system) for peripheral component interconnect express (PCIE) electronics housed within a chassis is disclosed. The system includes a mounting rail attached to a chassis, a cold/cooling plate having one or more mounting bolts attached to a side of the cold plate, the one or more mounting bolts to lock the cold plate to a fixing channel of the mounting rail to position a surface of the cold plate against a surface of the PCIE electronics, locking teeth of the fixing channels ensure a proper pressure being loaded horizontally on the PCIE electronics by the cold plate, and a fluid loop along a length of the mounting rail to circulate a fluid to the cold plate to cool the PCIE electronics.