Patent attributes
An apparatus and system for mechanically connecting components are provided. The apparatus includes a mechanical connecting joint that includes a first joint member formed of a material having a first coefficient of thermal expansion (CTE) value, the first joint member comprising a first sidewall, a second opposite sidewall, and a body extending therebetween. The mechanical connecting joint further includes a second joint member formed of a material having a second CTE value, the second CTE being less than the first CTE. The second joint member includes a first leg facing the first sidewall, a second leg facing the second sidewall, and a connecting member extending between the first leg and the second leg. A first gap is formed between the first joint member and the first leg and a second gap is formed between the first joint member and the second leg.
