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US Patent 10985089 Semiconductor cooling arrangement

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
January 30, 2018
Date of Patent
April 20, 2021
Patent Application Number
16482147
Patent Citations Received
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US Patent 12029012 Fluid immersion cooling system with multiple layers of coolant fluids
4
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US Patent 12027975 Packaged module with sintered switch
5
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US Patent 11533828 Electronic cooling systems
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US Patent 11277937 Re-entrant flow cold plate
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US Patent 11844193 Direct contact fluid based cooling module
9
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US Patent 11963341 High temperature electronic device thermal management system
10
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US Patent 11967899 Fluid cooled inverter
11
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US Patent 11996349 Power electronics for an electrical machine, drivetrain, motor vehicle
12
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US Patent 12016157 Actively cooled heat-dissipation lids for computer processors and assemblies
13
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10985089
Patent Primary Examiner
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Mukundbhai G Patel
Industry
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