Patent attributes
This invention provides a semiconductor package, the semiconductor package includes: a semiconductor chip having a connection pad; an encapsulant covering at least a portion of the semiconductor chip; and a connection structure disposed on the semiconductor chip and the encapsulant. The connection structure comprises a first insulation layer, a first redistribution layer disposed on the first insulation layer, and a second insulation layer disposed on the first insulation layer and covering the first redistribution layer. The first redistribution layer has one or more openings. The openings have a shape having a plurality of protrusions, respectively, and B/A is 1.5 or less, where A refers to a thickness of the first redistribution layer, and B refers to a thickness of a region of the second insulation layer covering the first redistribution layer.
