Patent attributes
An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.
