An electrical contact and connector (also known as elastic electrical contact and system) are disclosed herein for testing semiconductor devices such as integrated circuit (IC) packages, particular high density IC packages. The elastic electrical contact comprises a plurality of interlaced or interwove and unsupported conductive wires. The electrical contact system comprises the elastic electrical contacts and a carrier having a plurality of through openings. The elastic electrical contacts are placed in their respective through openings with both ends exposed from the through openings. Method of making and using the elastic electrical contact are also provided.