Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 27, 2021
Patent Application Number
16720876
Date Filed
December 19, 2019
Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.
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