Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoichiro Kurita0
Date of Patent
April 27, 2021
0Patent Application Number
165917970
Date Filed
October 3, 2019
0Patent Citations Received
Patent Primary Examiner
Patent abstract
According to one embodiment, the interconnect layer includes a fourth conductive member and a fifth conductive member. The fourth conductive member is provided between the first region of the first chip and the third region of the second chip. The fourth conductive member connects the first conductive member of the first chip and the second conductive member of the second chip. The fifth conductive member is provided between the second region of the first chip and the fifth region of the third chip. The fifth conductive member connects the first conductive member of the first chip and the third conductive member of the third chip. The first chip is provided between the first terminal and the second terminal.
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