Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 11, 2021
Patent Application Number
15857975
Date Filed
December 29, 2017
Patent Citations
Patent Primary Examiner
Patent abstract
An embodiment of a semiconductor package apparatus may include technology to establish communication between a first stationary unit and one or more vehicles, combine sensor data from the first stationary unit and at least one source outside the first stationary unit, generate an environmental map based on the combined sensor data, divide the environmental map into two or more map segments, and broadcast the two or more map segments. Other embodiments are disclosed and claimed.
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