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US Patent 11004811 Semiconductor structure

Patent 11004811 was granted and assigned to Taiwan Semiconductor Manufacturing Company on May, 2021 by the United States Patent and Trademark Office.

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Patent abstract

A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.

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