Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 11, 2021
Patent Application Number
16585337
Date Filed
September 27, 2019
Patent Citations
Patent Primary Examiner
Patent abstract
A method of fabricating a connection structure is disclosed. The method includes providing a substrate that has a top surface and includes a set of pads for soldering, each of which has a pad surface exposed from the top surface of the substrate. The method also includes applying a surface treatment to a part of the top surface of the substrate close to the pads and the pad surface of each pad so as to make at least the part of the top surface and the pad surfaces of the pads rougher.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
