Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 11, 2021
Patent Application Number
16289680
Date Filed
March 1, 2019
Patent Citations Received
Patent Primary Examiner
Patent abstract
A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.
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