US Patent 11011502 Semiconductor package

A semiconductor package includes a first package including a first semiconductor chip, a first encapsulation layer that covers the first semiconductor chip, and a first redistribution pattern connected to pads of the first semiconductor chip and a second package on the first package, the second package including a second semiconductor chip, a second encapsulation layer that covers the second semiconductor chip, and a second redistribution pattern connected to pads of the second semiconductor chip. The first redistribution pattern is connected to the second redistribution pattern through the first encapsulation layer.