Patent attributes
Disclosed in an embodiment are a semiconductor device and a semiconductor device package including the same, the semiconductor device comprising: a semiconductor structure including a first light emitting unit and a second light emitting unit; a first electrode for electrically connecting a first conductive type semiconductor layer of the first light emitting unit with a first conductive type semiconductor layer of the second light emitting unit; and a second electrode for electrically connecting a second conductive type semiconductor layer of the first light emitting unit with a second conductive type semiconductor layer of the second light emitting unit, wherein: the first electrode includes a first pad arranged on the first light emitting unit, a first branch electrode arranged on the first light emitting unit, and a first extension electrode arranged on the second light emitting unit; the second electrode includes a second pad arranged on the second light emitting unit, a second branch electrode arranged on the second light emitting unit, and a second extension electrode arranged on the first light emitting unit; the semiconductor structure includes a first spacing section which extends in a first direction and comparts the first light emitting unit and the second light emitting unit; and the first pad and the second pad are not overlapped in the first direction and a second direction which is perpendicular to the first direction.
