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US Patent 11018107 Semiconductor device
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Patent
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Date Filed
May 20, 2019
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Date of Patent
May 25, 2021
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Patent Application Number
16416756
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Patent Citations
US Patent 10199319 Printed circuit board and semiconductor package including the same
US Patent 10361170 Semiconductor package
US Patent 10163833 Multichip modules and methods of fabrication
Patent Citations Received
US Patent 11923315 Semiconductor package and manufacturing method thereof
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Patent Inventor Names
Seok Geun Ahn
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Young Rae Kim
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Ah Ra Jo
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Dong Hyun Kim
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Jae Hun Bae
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Min Hwa Chang
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Min Yoo
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Won Chul Do
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11018107
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Patent Primary Examiner
Dung A. Le
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