Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 25, 2021
Patent Application Number
16919505
Date Filed
July 2, 2020
Patent Citations
Patent Primary Examiner
Patent abstract
This disclosure describes systems, methods, and apparatus for multilayer superconducting structures comprising electroplated Rhenium, where the Rhenium operates in a superconducting regime at or above 4.2 K, or above 1.8 K where specific temperatures and times of annealing have occurred. The structure can include at least a first conductive layer applied to a substrate, where the Rhenium layer is electroplated to the first layer. A third layer formed from the same or a different conductor as the first layer can be formed atop the Rhenium layer.
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