Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 25, 2021
Patent Application Number
16448990
Date Filed
June 21, 2019
Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
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