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US Patent 11020869 Automated application of cut thermal adhesive films

Patent 11020869 was granted and assigned to Zazzle on June, 2021 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
Zazzle
Zazzle
Current Assignee
Zazzle
Zazzle
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11020869
Patent Inventor Names
Young Harvill0
Date of Patent
June 1, 2021
Patent Application Number
16707159
Date Filed
December 9, 2019
Patent Primary Examiner
‌
Jacob T Minskey
Patent abstract

Method of manufacturing a substrate with a cut thermal film comprises obtaining an input digital image of a design to be transferred to the substrate; storing the input image in memory; rendering design elements of the design as a single output image; based upon a bleed size value, a maximum number of negative areas, a maximum number of positive areas, and attribute values: resizing the image to include a border for bleed; filling transparent areas of the image with the substrate attribute values; creating a cutting path; creating a mask image; inverting the mask image; modifying the mask image to adjust fill areas around details, to limit negative areas to be less than the maximum number of negative areas, and to limit positive areas to be less than the maximum number of positive areas; creating cutting path data in memory as a vector path outlining the mask image.

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