Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsih-Yang Chiu0
Date of Patent
June 1, 2021
0Patent Application Number
165832900
Date Filed
September 26, 2019
0Patent Primary Examiner
Patent abstract
A semiconductor structure including a substrate, a dielectric layer, a conductive via, and a landing pad is provided. The dielectric layer is positioned on the substrate. The conductive via penetrates from a lower surface of the substrate to an upper surface of the dielectric layer. The landing pad is embedded in the conductive via.
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