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US Patent 11024577 Embedded anti-fuses for small scale applications
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Patent
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Date Filed
January 17, 2020
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Date of Patent
June 1, 2021
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Patent Application Number
16746146
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Patent Citations Received
US Patent 11251073 Selective deposition of barrier layer
US Patent 11876047 Decoupled interconnect structures
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Patent Inventor Names
Chih-Chao Yang
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Koichi Motoyama
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Chanro Park
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Kenneth Chun Kuen Cheng
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11024577
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Patent Primary Examiner
Peniel M Gumedzoe
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