Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 8, 2021
Patent Application Number
16564520
Date Filed
September 9, 2019
Patent Citations
Patent Primary Examiner
Patent abstract
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
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