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US Patent 11031394 3D semiconductor device and structure
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Patent
Date Filed
February 7, 2021
Date of Patent
June 8, 2021
Patent Application Number
17169511
Patent Citations
US Patent 10199354 Die sidewall interconnects for 3D chip assemblies
US Patent 10950599 3D semiconductor device and structure
Patent Citations Received
US Patent 11942390 Thermal dissipation in semiconductor devices
0
US Patent 11355410 Thermal dissipation in semiconductor devices
US Patent 11450646 3D semiconductor device and structure with metal layers
US Patent 11876037 Chip stacking and packaging structure
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11031394
Patent Primary Examiner
Tu-Tu V Ho
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