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US Patent 11034090 Filament buffer

Patent 11034090 was granted and assigned to Essentium on June, 2021 by the United States Patent and Trademark Office.

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Patent
Patent

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Patent Applicant
Essentium
Essentium
Current Assignee
Essentium
Essentium
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11034090
Date of Patent
June 15, 2021
Patent Application Number
16273825
Date Filed
February 12, 2019
Patent Primary Examiner
‌
Joseph S Del Sole
Patent abstract

A machine for manufacturing additive printed parts includes a first filament cartridge adapted to support a length of filament of a material from which the additive printed parts will be manufactured, a print head moveably supported within the machine, and a first filament buffer positioned between the first filament cartridge and the print head and including a first buffer volume. The filament supported within the first filament cartridge extends from the first filament cartridge, through the first filament buffer, and to the print head and is allowed to deflect within the first buffer volume.

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