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US Patent 11036002 Photonic communication platform
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Patent
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Date Filed
March 5, 2020
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Date of Patent
June 15, 2021
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Patent Application Number
16810573
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Patent Citations Received
US Patent 12092867 Photonic communication platform
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US Patent 12124081 Photonic communication platform
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US Patent 12124082 Photonic communication platform
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US Patent 11754783 Photonic communication platform
US Patent 12130484 Yield enhancement techniques for photonic communications platform
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US Patent 12124095 Optical multi-die interconnect bridge with optical interface
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US Patent 12130485 Stacked-dies optically bridged multicomponent package
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US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
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US Patent 11916602 Remote memory architectures enabled by monolithic in-package optical i/o
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US Patent 11860413 Photonic communication platform
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•••
Patent Inventor Names
Ryan Braid
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Carl Ramey
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Darius Bunandar
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Michael Gould
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Mykhailo Tymchenko
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Nicholas C. Harris
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Thomas Graham
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11036002
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Patent Primary Examiner
Chad H Smith
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