Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 22, 2021
Patent Application Number
16294044
Date Filed
March 6, 2019
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device according to an embodiment comprises a semiconductor substrate having a through hole from a first face to a second face on an opposite side to the first face. A metal part is provided inside the through hole. A stacked film is provided between the metal part and an inner side surface of the through hole, and comprises a plurality of different material films of two or more types having a relative permittivity equal to or lower than 6.5.
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