US Patent 11043441 Fan-out semiconductor package

A semiconductor package includes: a semiconductor chip having an active surface, having connection pads disposed thereon, and an inactive surface, opposing the active surface; an encapsulant covering the inactive surface of the semiconductor chip; a thermally conductive via penetrating through at least a portion of the encapsulant on the inactive surface of the semiconductor chip and physically spaced apart from the inactive surface of the semiconductor chip; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads.