US Patent 11043482 Semiconductor component, package structure and manufacturing method thereof
Patent 11043482 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2021 by the United States Patent and Trademark Office.
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A package manufacturing having a semiconductor substrate, a bonding layer, at least one semiconductor device, a redistribution circuit structure and an insulating encapsulation. The bonding layer is disposed on the semiconductor substrate. The semiconductor device is disposed on and in contact with a portion of the bonding layer, wherein the bonding layer is located between the semiconductor substrate and the semiconductor device and adheres the semiconductor device onto the semiconductor substrate. The redistribution circuit structure is disposed on and electrically connected to the semiconductor device, wherein the semiconductor device is located between the redistribution circuit structure and the bonding layer. The insulating encapsulation wraps a sidewall of the semiconductor device, wherein a sidewall of the bonding layer is aligned with a sidewall of the insulating encapsulation and a sidewall of the redistribution circuit structure.
US Patent 11043482 Semiconductor component, package structure and manufacturing method thereof
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