Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 22, 2021
Patent Application Number
16803012
Date Filed
February 27, 2020
Patent Primary Examiner
Patent abstract
The invention discloses a heat dissipation architecture. The heat dissipation architecture includes an electronic component, a flexible heat conductive film and a heat conductor. The flexible heat conductive film is disposed on the electronic component. The heat conductor includes a first portion and a second portion connected to the first portion. The first portion of the heat conductor is interposed in the flexible heat conductive film.
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