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US Patent 11054593 Chip-scale optoelectronic transceiver with microspringed interposer
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Patent
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Date Filed
March 11, 2020
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Date of Patent
July 6, 2021
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Patent Application Number
16815932
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Patent Citations
US Patent 10215938 Photoelectric conversion assembly
US Patent 10168482 Micro-filter structures for wavelength division multiplexing in polymer waveguides
US Patent 10765370 Systems and methods for neurological traffic and/or receptor functional evaluation and/or modification
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US Patent 10739518 Optical components for wavelength division multiplexing with high-density optical interconnect modules
US Patent 10004458 Systems and methods for neurological traffic and/or receptor functional evaluation and/or modification
Patent Citations Received
US Patent 12092873 Optical fiber coupler
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US Patent 11677472 Hybrid integration of microLED interconnects with ICs
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US Patent 11835777 Optical multi-die interconnect bridge (OMIB)
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US Patent 11513301 Chip-scale optoelectronic transceiver having microsprings on an interposer substrate
Patent Inventor Names
Christopher L. Chua
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
11054593
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Patent Primary Examiner
Andrew Jordan
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