US Patent 11056426 Metallization interconnect structure formation
Is a
Date Filed
May 29, 2019
0
Date of Patent
July 6, 2021
0
Patent Application Number
16425524
0
Patent Citations Received
Patent Inventor Names
Chih-Chao Yang
0
Hosadurga Shobha
0
Hsueh-Chung Chen
0
Yann Mignot
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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